About 2.5D Technology | NHanced Semiconductors, Inc.
Advanced Semiconductor Packaging Paves Way to Data-Centric Future | IDTechEx Research Article
Chip Packaging Part 4 - 2.5D and 3D Packaging | Electronic Design
Speeding Up 3D Design
Reasons Why 3D Semiconductor Packaging is Preferred over Other Packaging Technologies
3D Semiconductor & Packaging Technology for Systems - IBM
About 3D ICs | NHanced Semiconductors, Inc.
Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox | Intel Newsroom
The Need For 3D IC Packaging And Design Evolution
Next-Gen 3D Chip/Packaging Race Begins
Advanced Semiconductor Packaging Starting To Change Memory Market Landscape | Seeking Alpha
Packaging options and advances for digital ICs
3D Architectures for Semiconductor Integration and Packaging - SemiWiki
Challenges and recent prospectives of 3D heterogeneous integration - ScienceDirect
Is 3D IC The Next Big Profit Driver? - EE Times
2.5D and 3D IC Packaging | ASE
10 basic advanced IC packaging terms to know
Samsung foundry ramps up chip packaging to compete against TSMC - KED Global
1.2.2 Classification and Designs
Advanced Packaging's Next Wave
Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications – Samsung Global Newsroom
Semiconductor Packaging (3D IC) Emerging As Innovation Enabler! - SemiWiki
Eight requirements for successful 3D-IC design
3D IC Integration and 3D IC Packaging | SpringerLink
Global 3D Semiconductor Packaging to be $8.9Bn by 2022 - Report
Samsung Electronics Develops Industry's First 12-Layer 3D-TSV Chip Packaging Technology – Samsung Global Newsroom
3D IC and 2.5D IC Packaging Market in-Depth Analysis Taiwan
3D Semiconductor Packaging - Global Market Trajectory & Analytics
Semiconductor Materials – Rlab
