Global 3D Semiconductor Packaging to be $8.9Bn by 2022 - Report
3D Packaging Versus 3D Integration - Breakfast Bytes - Cadence Blogs - Cadence Community
How 3D Keeps the Semiconductor Industry Scaling- 3D InCites
Samsung foundry ramps up chip packaging to compete against TSMC - KED Global
3D Semiconductor & Packaging Technology for Systems - IBM
Challenges and recent prospectives of 3D heterogeneous integration - ScienceDirect
2.5D and 3D IC Packaging | ASE
2.5D and 3D ICs: New Paradigms in ASIC | Product Engineering Blog | eInfochips
The Need For 3D IC Packaging And Design Evolution
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
3D Semiconductor & Packaging Technology for Systems - IBM
Samsung Electronics Develops Industry's First 12-Layer 3D-TSV Chip Packaging Technology – Samsung Global Newsroom
Advanced Packaging's Next Wave
Lost in the advanced IC packaging labyrinth? Know these 10 basic terms
3D IC PACKAGING Project - YouTube
Reasons Why 3D Semiconductor Packaging is Preferred over Other Packaging Technologies
Packaging options and advances for digital ICs
Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox | Intel Newsroom
3D Packaging is transforming the world of Semiconductor Packaging – Webcast - YouTube
Chip Packaging Part 4 - 2.5D and 3D Packaging | Electronic Design
Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications – Samsung Global Newsroom
3D IC Integration and 3D IC Packaging | SpringerLink
